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Controlled electropolishing of copper foils at elevated temperature

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Title
Controlled electropolishing of copper foils at elevated temperature
Author(s)
Kwon, Gi Duk; Kim, Young Woo; Moyen, Eric; Keum, Dong Hoon; Young Hee Lee; Seunghyun Baik; Pribat, Didier
Publication Date
2014-07
Journal
APPLIED SURFACE SCIENCE, v.307, no., pp.731 - 735
Publisher
ELSEVIER SCIENCE BV
Abstract
We have studied the electrochemical polishing of copper foils at elevated temperature, in H3PO4 electrolytes of various concentrations. Atomic force microscopy, surface reflectance measurements as well as optical microscopy and scanning electron microscopy (including electron backscattering diffraction) have been used throughout this study to characterize the surface of the electropolished foils. We have found that copper foils electropolished at 65 °C in 2.17 M H3PO4, exhibited a lower surface roughness and a higher percent specular reflection, comparing with values obtained after classical electropolishing in concentrated H 3PO4 at room temperature or comparing with values obtained after chemical-mechanical polishing. This work could open up new prospects for the preparation of copper foils before the growth of high quality graphene layers. © 2014 Elsevier B.V. All rights reserved.
URI
https://pr.ibs.re.kr/handle/8788114/974
ISSN
0169-4332
Appears in Collections:
Center for Integrated Nanostructure Physics(나노구조물리 연구단) > Journal Papers (저널논문)
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