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Universal transfer of 2D materials grown on Au substrate using sulfur intercalation

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Title
Universal transfer of 2D materials grown on Au substrate using sulfur intercalation
Author(s)
Soo Ho Choi; Choi, Ji Hoon; Oh, Chang Seok; Han, Gyeongtak; Jeong, Hu Young; Young-Min Kim; Kim, Soo Min; Ki Kang Kim
Publication Date
2021-03
Journal
Applied Science and Convergence Technology, v.30, no.2, pp.45 - 49
Publisher
Korean Vacuum Society
Abstract
© 2021, Korean Vacuum Society. All rights reserved.Herein, we report on a novel method for transferring two-dimensional (2D) materials grown on Au substrates using sulfur intercalation between the 2D materials and the Au surfaces. The strong nature of the S–Au bond allows intercalation of sulfur atoms into their interface, under a sulfurrich atmosphere, at 600 ∘C. The relaxed interfacial interaction achieved via intercalation is carefully confirmed by recovering phonon mode and work function of tungsten disulfide (WS2) in Raman spectra and Kelvin probe force microscopy, and, more importantly, by observing the expansion of the interfacial distance, from 0.24 to 0.44 nm, using cross-sectional transmission electron microscopy. The released interactions facilitate delamination of WS2 from the Au surface, using an electrochemical bubbling method. The resultant Au foil then is reused for repeated WS2 growth. The successful transfer of other 2D materials, including molybdenum disulfide and hexagonal boron nitride, is also demonstrated. Our strategy advances the use of Au substrates for growing wafer-scale 2D monolayers.
URI
https://pr.ibs.re.kr/handle/8788114/9752
DOI
10.5757/ASCT.2021.30.2.45
ISSN
1225-8822
Appears in Collections:
Center for Integrated Nanostructure Physics(나노구조물리 연구단) > 1. Journal Papers (저널논문)
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