Designed Assembly and Integration of Colloidal Nanocrystals for Device Applications Highly Cited Paper

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Title
Designed Assembly and Integration of Colloidal Nanocrystals for Device Applications
Author(s)
Jiwoong Yang; Moon Kee Choi; Dae-Hyeong Kim; Taeghwan Hyeon
Publication Date
2016-02
Journal
ADVANCED MATERIALS, v.28, no.6, pp.1176 - 1207
Publisher
WILEY-V C H VERLAG GMBH
Abstract
Colloidal nanocrystals have been intensively studied over the past three decades due to their unique properties that originate, in large part, from their nanometer-scale sizes. For applications in electronic and optoelectronic devices, colloidal nanoparticles are generally employed as assembled nanocrystal solids, rather than as individual particles. Consequently, tailoring 2D patterns as well as 3D architectures of assembled nanocrystals is critical for their various applications to micro- and nanoscale devices. Here, recent advances in the designed assembly, film fabrication, and printing/integration methods for colloidal nanocrystals are presented. The advantages and drawbacks of these methods are compared, and various device applications of assembled/integrated colloidal nanocrystal solids are discussed. © 2015 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim
URI
https://pr.ibs.re.kr/handle/8788114/2619
ISSN
0935-9648
Appears in Collections:
Center for Nanoparticle Research(나노입자 연구단) > Journal Papers (저널논문)
Files in This Item:
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