Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics Highly Cited Paper

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Title
Dense dislocation arrays embedded in grain boundaries for high-performance bulk thermoelectrics
Author(s)
Sang Il Kim; Kyu Hyoung Lee; Hyeon A. Mun; Hyun Sik Kim; Sung Woo Hwang; Jong Wook Roh; Dae Jin Yang; Weon Ho Shin; Xiang Shu Li; Young Hee Lee; G. Jeffrey Snyder; Sung Wng Kim
Publication Date
2015-04
Journal
SCIENCE, v.348, no.6230, pp.109 - 114
Publisher
AMER ASSOC ADVANCEMENT SCIENCE
Abstract
The widespread use of thermoelectric technology is constrained by a relatively low conversion efficiency of the bulk alloys, which is evaluated in terms of a dimensionless figure of merit (zT).The zTof bulk alloys can be improved by reducing lattice thermal conductivity through grain boundary and point-defect scattering, which target low- and high-frequency phonons. Dense dislocation arrays formed at low-energy grain boundaries by liquid-phase compaction in Bi0.5Sb1.5Te3 (bismuth, antimony, tellurium) effectively scatter midfrequency phonons, leading to a substantially lower lattice thermal conductivity. Full-spectrum phonon scattering with minimal charge-carrier scattering dramatically improved the zT to 1.86 +− 0.15 at 320 kelvin (K). Further, a thermoelectric cooler confirmed the performance with a maximum temperature difference of 81 K, which is much higher than current commercial Peltier cooling devices.
URI
https://pr.ibs.re.kr/handle/8788114/1609
ISSN
0036-8075
Appears in Collections:
Center for Integrated Nanostructure Physics(나노구조물리 연구단) > Journal Papers (저널논문)
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