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나노입자 연구단
나노입자 연구단
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Materials and Fabrication Processes for Transient and Bioresorbable High-Performance Electronics

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Title
Materials and Fabrication Processes for Transient and Bioresorbable High-Performance Electronics
Author(s)
Suk-Won Hwang; Dae-Hyeong Kim; Tao, H.; Kim, T.I.; Yu, K.J.; Panilaitis, B.; Jeong, J.W.; Song, J.K.; Omenetto, F.G.; Kim, S.; Rogers, J.A.
Publication Date
2013-09
Journal
ADVANCED FUNCTIONAL MATERIALS, v.23, no.33, pp.4087 - 4093
Publisher
WILEY-V C H VERLAG GMBH
Abstract
Materials and fabrication procedures are described for bioresorbable transistors and simple integrated circuits, in which the key processing steps occur on silicon wafer substrates, in schemes compatible with methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer to yield devices that exploit ultrathin sheets of monocrystalline silicon for the semiconductor, thin fi lms of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics, and silk for the substrates. A range of component examples with detailed measurements of their electrical characteristics and dissolution properties illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. The results have signifi cance for broad classes of water-soluble, "transient" electronic devices.
URI
https://pr.ibs.re.kr/handle/8788114/1261
ISSN
1616-301X
Appears in Collections:
Center for Nanoparticle Research(나노입자 연구단) > Journal Papers (저널논문)
Files in This Item:
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