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Flat-surface-assisted and self-regulated oxidation resistance of Cu(111)

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Title
Flat-surface-assisted and self-regulated oxidation resistance of Cu(111)
Author(s)
Kim, Su Jae; Kim, Yong In; Lamichhane, Bipin; Kim, Young-Hoon; Lee, Yousil; Cho, Chae Ryong; Cheon, Miyeon; Kim, Jong Chan; Jeong, Hu Young; Taewoo Ha; Kim, Jungdae; Young Hee Lee; Kim, Seong-Gon; Young-Min Kim; Jeong, Se-Young
Publication Date
2022-03
Journal
Nature, v.603, no.7901, pp.434 - 438
Publisher
Nature Research
Abstract
© 2022 Springer Nature Limited. Oxidation can deteriorate the properties of copper that are critical for its use, particularly in the semiconductor industry and electro-optics applications1–7. This has prompted numerous studies exploring copper oxidation and possible passivation strategies8. In situ observations have, for example, shown that oxidation involves stepped surfaces: Cu2O growth occurs on flat surfaces as a result of Cu adatoms detaching from steps and diffusing across terraces9–11. But even though this mechanism explains why single-crystalline copper is more resistant to oxidation than polycrystalline copper, the fact that flat copper surfaces can be free of oxidation has not been explored further. Here we report the fabrication of copper thin films that are semi-permanently oxidation resistant because they consist of flat surfaces with only occasional mono-atomic steps. First-principles calculations confirm that mono-atomic step edges are as impervious to oxygen as flat surfaces and that surface adsorption of O atoms is suppressed once an oxygen face-centred cubic (fcc) surface site coverage of 50% has been reached. These combined effects explain the exceptional oxidation resistance of ultraflat Cu surfaces.
URI
https://pr.ibs.re.kr/handle/8788114/11580
DOI
10.1038/s41586-021-04375-5
ISSN
0028-0836
Appears in Collections:
Center for Integrated Nanostructure Physics(나노구조물리 연구단) > 1. Journal Papers (저널논문)
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