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Strongly adhesive dry transfer technique for van der Waals heterostructure

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Title
Strongly adhesive dry transfer technique for van der Waals heterostructure
Author(s)
Suhan Son; Young Jae Shin; Kaixuan Zhang; Jeacheol Shin; Sungmin Lee; Hiroshi Idzuchi; Matthew J Coak; Hwangsun Kim; Jangwon Kim; Jae Hoon Kim; Miyoung Kim; Dohun Kim; Philip Kim; Je-Geun Park
Subject
two-dimensional materials, ; van der Waals heterostructures, ; polycaprolactone, ; dry transfer technique, ; NbSe2, ; transition metal thiophosphate
Publication Date
2020-10
Journal
2D MATERIALS, v.7, no.4, pp.041005
Publisher
IOP PUBLISHING LTD
Abstract
© 2020 IOP Publishing Ltd. That one can stack van der Waals materials with atomically sharp interfaces has provided a new material platform of constructing heterostructures. The technical challenge of mechanical stacking is picking up the exfoliated atomically thin materials after mechanical exfoliation without chemical and mechanical degradation. Chemically inert hexagonal boron nitride (hBN) has been widely used for encapsulating and picking up vdW materials. However, due to the relatively weak adhesion of hBN, assembling vdW heterostructures based on hBN has been limited. We report a new dry transfer technique. We used two vdW semiconductors (ZnPS(3)and CrPS4) to pick up and encapsulate layers for vdW heterostructures, which otherwise are known to be hard to fabricate. By combining with optimized polycaprolactone (PCL) providing strong adhesion, we demonstrated various vertical heterostructure devices, including quasi-2D superconducting NbSe(2)Josephson junctions with atomically clean interface. The versatility of the PCL-based vdW stacking method provides a new route for assembling complex 2D vdW materials without interfacial degradation
URI
https://pr.ibs.re.kr/handle/8788114/7612
DOI
10.1088/2053-1583/abad0b
ISSN
2053-1583
Appears in Collections:
Center for Correlated Electron Systems(강상관계 물질 연구단) > 1. Journal Papers (저널논문)
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