Camphor-Enabled Transfer and Mechanical Testing of Centimeter-Scale Ultrathin Films

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Title
Camphor-Enabled Transfer and Mechanical Testing of Centimeter-Scale Ultrathin Films
Author(s)
Bin Wang; Da Luo; Zhancheng Li; Youngwoo Kwon; Meihui Wang; Min Goo; Sunghwan Jin; Ming Huang; Yongtao Shen; Haofei Shi; Feng Ding; Rodney S. Ruoff
Publication Date
2018-07
Journal
ADVANCED MATERIALS, v.30, no.28, pp.1800888 -
Publisher
WILEY-V C H VERLAG GMBH
Abstract
Camphor is used to transfer centimeter-scale ultrathin films onto customdesigned substrates for mechanical (tensile) testing. Compared to traditional transfer methods using dissolving/peeling to remove the support-layers,camphor is sublimed away in air at low temperature, thereby avoiding additional stress on the as-transferred films. Large-area ultrathin films can be transferred onto hollow substrates without damage by this method. Tensile measurements are made on centimeter-scale 300 nm-thick graphene oxide film specimens, much thinner than the ≈2 μm minimum thickness of macroscale graphene-oxide films previously reported. Tensile tests were also done on two different types of large-area samples of adlayer free CVD-grown single-layer graphene supported by a ≈100 nm thick polycarbonate film; graphene stiffens this sample significantly, thus the intrinsic mechanical response of the graphene can be extracted. This is the first tensile measurement of centimeter-scale monolayer graphene films. The Young’s modulus of polycrystalline graphene ranges from 637 to 793 GPa, while for near singlecrystal graphene, it ranges from 728 to 908 GPa (folds parallel to the tensile loading direction) and from 683 to 775 GPa (folds orthogonal to the tensile loading direction), demonstrating the mechanical performance of large-area graphene in a size scale relevant to many applications. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
URI
https://pr.ibs.re.kr/handle/8788114/5478
ISSN
0935-9648
Appears in Collections:
Center for Multidimensional Carbon Materials(다차원 탄소재료 연구단) > Journal Papers (저널논문)
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16. Wang_et_al-2018-Advanced_Materials.pdfDownload

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