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Universal assembly of liquid metal particles in polymers enables elastic printed circuit board

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Title
Universal assembly of liquid metal particles in polymers enables elastic printed circuit board
Author(s)
Lee, Wonbeom; Kim, Hyunjun; Kang, Inho; Hongjun Park; Jung, Jiyoung; Lee, Haeseung; Park, Hyunchang; Park, Ji Su; Yuk, Jong Min; Ryu, Seunghwa; Jeong, Jae-Woong; Kang, Jiheong
Publication Date
2022-11
Journal
Science, v.378, no.6620, pp.637 - 641
Publisher
American Association for the Advancement of Science
Abstract
© 2022 American Association for the Advancement of Science. All rights reserved.An elastic printed circuit board (E-PCB) is a conductive framework used for the facile assembly of system-level stretchable electronics. E-PCBs require elastic conductors that have high conductivity, high stretchability, tough adhesion to various components, and imperceptible resistance changes even under large strain. We present a liquid metal particle network (LMPNet) assembled by applying an acoustic field to a solid-state insulating liquid metal particle composite as the elastic conductor. The LMPNet conductor satisfies all the aforementioned requirements and enables the fabrication of a multilayered high-density E-PCB, in which numerous electronic components are intimately integrated to create highly stretchable skin electronics. Furthermore, we could generate the LMPNet in various polymer matrices, including hydrogels, self-healing elastomers, and photoresists, thus showing their potential for use in soft electronics.
URI
https://pr.ibs.re.kr/handle/8788114/12593
DOI
10.1126/science.abo6631
ISSN
0036-8075
Appears in Collections:
Center for Nanomaterials and Chemical Reactions(나노물질 및 화학반응 연구단) > 1. Journal Papers (저널논문)
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