Universal assembly of liquid metal particles in polymers enables elastic printed circuit boardHighly Cited PaperHot Paper
DC Field | Value | Language |
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dc.contributor.author | Lee, Wonbeom | - |
dc.contributor.author | Kim, Hyunjun | - |
dc.contributor.author | Kang, Inho | - |
dc.contributor.author | Hongjun Park | - |
dc.contributor.author | Jung, Jiyoung | - |
dc.contributor.author | Lee, Haeseung | - |
dc.contributor.author | Park, Hyunchang | - |
dc.contributor.author | Park, Ji Su | - |
dc.contributor.author | Yuk, Jong Min | - |
dc.contributor.author | Ryu, Seunghwa | - |
dc.contributor.author | Jeong, Jae-Woong | - |
dc.contributor.author | Kang, Jiheong | - |
dc.date.accessioned | 2023-01-26T02:34:05Z | - |
dc.date.available | 2023-01-26T02:34:05Z | - |
dc.date.created | 2022-11-29 | - |
dc.date.issued | 2022-11 | - |
dc.identifier.issn | 0036-8075 | - |
dc.identifier.uri | https://pr.ibs.re.kr/handle/8788114/12593 | - |
dc.description.abstract | © 2022 American Association for the Advancement of Science. All rights reserved.An elastic printed circuit board (E-PCB) is a conductive framework used for the facile assembly of system-level stretchable electronics. E-PCBs require elastic conductors that have high conductivity, high stretchability, tough adhesion to various components, and imperceptible resistance changes even under large strain. We present a liquid metal particle network (LMPNet) assembled by applying an acoustic field to a solid-state insulating liquid metal particle composite as the elastic conductor. The LMPNet conductor satisfies all the aforementioned requirements and enables the fabrication of a multilayered high-density E-PCB, in which numerous electronic components are intimately integrated to create highly stretchable skin electronics. Furthermore, we could generate the LMPNet in various polymer matrices, including hydrogels, self-healing elastomers, and photoresists, thus showing their potential for use in soft electronics. | - |
dc.language | 영어 | - |
dc.publisher | American Association for the Advancement of Science | - |
dc.title | Universal assembly of liquid metal particles in polymers enables elastic printed circuit board | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.identifier.wosid | 000898883700010 | - |
dc.identifier.scopusid | 2-s2.0-85141557666 | - |
dc.identifier.rimsid | 79219 | - |
dc.contributor.affiliatedAuthor | Hongjun Park | - |
dc.identifier.doi | 10.1126/science.abo6631 | - |
dc.identifier.bibliographicCitation | Science, v.378, no.6620, pp.637 - 641 | - |
dc.relation.isPartOf | Science | - |
dc.citation.title | Science | - |
dc.citation.volume | 378 | - |
dc.citation.number | 6620 | - |
dc.citation.startPage | 637 | - |
dc.citation.endPage | 641 | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalWebOfScienceCategory | Multidisciplinary Sciences | - |
dc.subject.keywordPlus | SILVER NANOPARTICLES | - |
dc.subject.keywordPlus | SOFT | - |
dc.subject.keywordPlus | FABRICATION | - |
dc.subject.keywordPlus | CONDUCTORS | - |