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Seong, Won Kyung
다차원 탄소재료 연구단
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Large-Area Uniform 1-nm-Level Amorphous Carbon Layers from 3D Conformal Polymer Brushes. A "Next-Generation" Cu Diffusion Barrier?

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Title
Large-Area Uniform 1-nm-Level Amorphous Carbon Layers from 3D Conformal Polymer Brushes. A "Next-Generation" Cu Diffusion Barrier?
Author(s)
Kang, Yun-Ho; Lee, Sangbong; Choi, Youngwoo; Won Kyung Seong; Han, Kyu Hyo; Kim, Jang Hwan; Kim, Hyun-Mi; Hong, Seungbum; Sun Hwa Lee; Rodney S. Ruoff; Kim, Ki-Bum; Kim, Sang Ouk
Publication Date
2022-04
Journal
ADVANCED MATERIALS, v.34, no.15
Publisher
WILEY-V C H VERLAG GMBH
Abstract
A reliable method for preparing a conformal amorphous carbon (a-C) layer with a thickness of 1-nm-level, is tested as a possible Cu diffusion barrier layer for next-generation ultrahigh-density semiconductor device miniaturization. A polystyrene brush of uniform thickness is grafted onto 4-inch SiO2/Si wafer substrates with "self-limiting" chemistry favoring such a uniform layer. UV crosslinking and subsequent carbonization transforms this polymer film into an ultrathin a-C layer without pinholes or hillocks. The uniform coating of nonplanar regions or surfaces is also possible. The Cu diffusion "blocking ability" is evaluated by time-dependent dielectric breakdown (TDDB) tests using a metal-oxide-semiconductor (MOS) capacitor structure. A 0.82 nm-thick a-C barrier gives TDDB lifetimes 3.3x longer than that obtained using the conventional 1.0 nm-thick TaNx diffusion barrier. In addition, this exceptionally uniform ultrathin polymer and a-C film layers hold promise for selective ion permeable membranes, electrically and thermally insulating films in electronics, slits of angstrom-scale thickness, and, when appropriately functionalized, as a robust ultrathin coating with many other potential applications.
URI
https://pr.ibs.re.kr/handle/8788114/11561
DOI
10.1002/adma.202110454
ISSN
0935-9648
Appears in Collections:
Center for Multidimensional Carbon Materials(다차원 탄소재료 연구단) > 1. Journal Papers (저널논문)
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