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Effective Assembly of Nano-Ceramic Materials for High and Anisotropic Thermal Conductivity in a Polymer Composite

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Title
Effective Assembly of Nano-Ceramic Materials for High and Anisotropic Thermal Conductivity in a Polymer Composite
Author(s)
Haeleen Hong; Jong Uk Kim; Tae-il Kim
Publication Date
2017-09
Journal
Polymers, v.9, no.9, pp.413 -
Abstract
Recently, anisotropic heat dissipation and its management have drawn attention as a promising technique for highly integrated electrical devices. Among many potentially challenging materials such as carbon nanotube, graphene, metal particles, and inorganic ceramics commonly used for high thermally conductive fillers in a composite form, nanoscale ceramic fillers are considered ideal candidates due to their thermal conductivity, electrical insulation, and low thermal expansion coefficient. However, enhancing the thermal conductivity of a randomly dispersed ceramic-polymer composite is limited by its discontinuous filler contact and thermal expansion coefficient mismatch. Thus, recent research has focused on how to assemble and generate highly networked filler contacts to make effective pathways for heat flow, with minimized concentration of the filler in the composite. In this review, we will introduce several essential strategies to assemble fillers with a two-or three-dimensional networked composite for highly enhanced anisotropic heat dissipation. Moreover, this review elucidates filler alignment effects compared to randomly dispersed ceramic composites. © 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
URI
http://pr.ibs.re.kr/handle/8788114/4081
DOI
10.3390/polym9090413
ISSN
2073-4360
Appears in Collections:
Center for Neuroscience Imaging Research (뇌과학 이미징 연구단) > Journal Papers (저널논문)
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