Multiple surface conduction channels via topological insulator and amorphous insulator thin film multi-stacks
DC Field | Value | Language |
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dc.contributor.author | Jerng, SK | - |
dc.contributor.author | Jeon, JH | - |
dc.contributor.author | Kim, Y | - |
dc.contributor.author | Jun Sung Kim | - |
dc.contributor.author | Chun, SH | - |
dc.date.available | 2019-11-13T07:34:02Z | - |
dc.date.created | 2019-06-19 | - |
dc.date.issued | 2019-03 | - |
dc.identifier.issn | 1567-1739 | - |
dc.identifier.uri | https://pr.ibs.re.kr/handle/8788114/6480 | - |
dc.description.abstract | Multi-channel Bi2Se3 thin films were grown by combining molecular beam epitaxy and atomic layer deposition. High-resolution transmission electron microscope images showed that c-axis oriented Bi2Se3 grew on amorphous Al2O3 even after multiple stacking. While the surface morphology degraded for the upper layers, each layer was electrically similar. The electrical transport measurements showed that the weak anti-localization effect was quantitatively enhanced upon increasing the number of Bi2Se3 channels. Our results provide a promising approach to exploit diverse combinations of layered topological insulator films vertically stacked with amorphous insulator films. c.2018 Korean Physical Society. Published by Elsevier B.V. All rights reserved. | - |
dc.description.uri | 1 | - |
dc.language | 영어 | - |
dc.publisher | ELSEVIER SCIENCE BV | - |
dc.subject | Topological insulator | - |
dc.subject | Bismuth selenide | - |
dc.subject | van der Waals epitaxy | - |
dc.subject | Molecular beam epitaxy | - |
dc.subject | Atomic layer deposition | - |
dc.title | Multiple surface conduction channels via topological insulator and amorphous insulator thin film multi-stacks | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.identifier.wosid | 000458392100004 | - |
dc.identifier.scopusid | 2-s2.0-85050670616 | - |
dc.identifier.rimsid | 68614 | - |
dc.contributor.affiliatedAuthor | Jun Sung Kim | - |
dc.identifier.doi | 10.1016/j.cap.2018.07.020 | - |
dc.identifier.bibliographicCitation | CURRENT APPLIED PHYSICS, v.19, no.3, pp.219 - 223 | - |
dc.citation.title | CURRENT APPLIED PHYSICS | - |
dc.citation.volume | 19 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 219 | - |
dc.citation.endPage | 223 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordPlus | SINGLE DIRAC CONE | - |
dc.subject.keywordPlus | BI2SE3 | - |
dc.subject.keywordPlus | GROWTH | - |
dc.subject.keywordPlus | TRANSPORT | - |
dc.subject.keywordPlus | FIELD | - |
dc.subject.keywordPlus | GAP | - |
dc.subject.keywordAuthor | Topological insulator | - |
dc.subject.keywordAuthor | Bismuth selenide | - |
dc.subject.keywordAuthor | van der Waals epitaxy | - |
dc.subject.keywordAuthor | Molecular beam epitaxy | - |
dc.subject.keywordAuthor | Atomic layer deposition | - |