Thin Film Receiver Materials for Deterministic Assembly by Transfer Printing
DC Field | Value | Language |
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dc.contributor.author | Tae-il Kim | - |
dc.contributor.author | Kim, Mo Joon | - |
dc.contributor.author | Jung, Yei Hwan | - |
dc.contributor.author | Hyejin Jang | - |
dc.contributor.author | Dagdeviren, Canan | - |
dc.contributor.author | Pao, Hsuan An | - |
dc.contributor.author | Cho, Sang June | - |
dc.contributor.author | Carlson, Andrew | - |
dc.contributor.author | Yu, Ki Jun | - |
dc.contributor.author | Ameen, Abid | - |
dc.contributor.author | Chung, Hyun-joong | - |
dc.contributor.author | Jin, Sung Hun | - |
dc.contributor.author | Ma, Zhenqiang | - |
dc.contributor.author | Rogers, John A. | - |
dc.date.available | 2015-04-20T05:51:13Z | - |
dc.date.created | 2014-08-11 | - |
dc.date.issued | 2014-06 | - |
dc.identifier.issn | 0897-4756 | - |
dc.identifier.uri | https://pr.ibs.re.kr/handle/8788114/1009 | - |
dc.description.abstract | We present a specially designed materials chemistry that provides ultrathin adhesive layers with persistent tacky surfaces in solid, nonflowable forms for use in transfer printing and related approaches to materials and micro/nanostructure assembly. The material can be photocured after assembly, to yield a robust and highly transparent coating that is also thermally and electrically stable, for applications in electronics, optoelectronics, and other areas of interest. © 2014 American Chemical Society. | - |
dc.language | 영어 | - |
dc.publisher | AMER CHEMICAL SOC | - |
dc.subject | Chemistry | - |
dc.subject | Materials science | - |
dc.subject | Adhesive layers | - |
dc.subject | Materials chemistry | - |
dc.subject | Micro/nanostructures | - |
dc.subject | Transfer printing | - |
dc.subject | Transparent coatings | - |
dc.subject | Ultra-thin | - |
dc.subject | Printing | - |
dc.title | Thin Film Receiver Materials for Deterministic Assembly by Transfer Printing | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.identifier.wosid | 000337199400023 | - |
dc.identifier.scopusid | 2-s2.0-84902125012 | - |
dc.identifier.rimsid | 150 | ko |
dc.date.tcdate | 2018-10-01 | - |
dc.contributor.affiliatedAuthor | Tae-il Kim | - |
dc.contributor.affiliatedAuthor | Hyejin Jang | - |
dc.identifier.doi | 10.1021/cm501002b | - |
dc.identifier.bibliographicCitation | CHEMISTRY OF MATERIALS, v.26, no.11, pp.3502 - 3507 | - |
dc.relation.isPartOf | CHEMISTRY OF MATERIALS | - |
dc.citation.title | CHEMISTRY OF MATERIALS | - |
dc.citation.volume | 26 | - |
dc.citation.number | 11 | - |
dc.citation.startPage | 3502 | - |
dc.citation.endPage | 3507 | - |
dc.date.scptcdate | 2018-10-01 | - |
dc.description.wostc | 19 | - |
dc.description.scptc | 20 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordPlus | ELECTRONICS | - |
dc.subject.keywordPlus | SILICON | - |
dc.subject.keywordPlus | DEVICES | - |
dc.subject.keywordPlus | LITHOGRAPHY | - |
dc.subject.keywordPlus | MULTILAYERS | - |
dc.subject.keywordPlus | TRANSIENT | - |